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subminiature high performance ts algaas red led lamps technical data hlmp-p106/p156 hlmp-q102/q152 hlmp-q106/q156 features ? subminiature flat top package ideal for backlighting and light piping applications ? subminiature dome package diffused dome for wide viewing angle non-diffused dome for high brightness ? wide range of drive currents 500 m a to 50 ma ? ideal for space limited applications ? axial leads ? available with lead configurations for surface mount and through hole pc board mounting dome packages the hlmp-qxxx series dome lamps, for use as indicators, use a tinted, diffused lens to provide a wide viewing angle with high on- off contrast ratio. high brightness lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern. lead configurations all of these devices are made by encapsulating led chips on axial lead frames to form molded epoxy subminiature lamp packages. a variety of package configuration options is available. these include special surface mount lead configurations, gull wing, yoke lead, or z-bend. right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. for more information refer to standard smt and through hole lead bend options for subminiature led lamps data sheet. technology these subminiature solid state lamps utilize a highly optimized led material technology, transparent substrate aluminum gallium arsenide (ts algaas). this led technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 m a to 50 ma). the color is deep red at a dominant wavelength of 644 nm deep red. ts algaas is a flip-chip led technology, die attached to the anode lead and wire bonded to the cathode lead. available viewing angles are 75 , 35 , and 15 . description flat top package the hlmp-pxxx series flat top lamps use an untinted, non- diffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. the flat top lamps are also ideal for use as emitters in light pipe applications.
2 device selection guide viewing angle deep red typical iv typical iv package package description 2 q 1/2 r d = 644 nm i f = 500 m ai f = 20 ma outline domed, diffused tinted, 35 hlmp-q102 100 b standard current domed, diffused tinted, 35 hlmp-q152 2 b low current domed, nondiffused 15 hlmp-q106 400 b untinted, standard current domed, nondiffused 15 hlmp-q156 7 b untinted, low current flat top, nondiffused, 75 hlmp-p106 130 a untinted, standard current flat top, nondiffused 75 hlmp-p156 2 a untinted, low current ordering information hlmx-xxxx-x x x x x 4 x 4 prod. part number min. iv bin max. iv bin color bin selection packaging option
3 figure 1. proper right angle mounting to a pc board to prevent protruding anode tab from shorting to cathode connection. package dimensions a) flat top lamps b) diffused and nondiffused dome lamps no. cathode down. yes. anode down. anode tab 0.46 0.56 (0.018) (0.022) 1.40 1.65 (0.055) (0.065) 0.25 (0.010) max.* note 2 0.20 (0.008) max. 0.50 (0.020) ref. note 3 anode 1.65 1.91 (0.065) (0.075) dia. cathode 11.68 10.67 (0.460) (0.420) both sides * refer to figure 1 for design conerns. 2.44 1.88 (0.096) (0.074) 2.08 2.34 (0.082) (0.092) 1.14 1.40 (0.045) (0.055) 0.63 0.38 (0.025) (0.015) 2.21 1.96 (0.087) (0.077) 0.18 0.23 (0.007) (0.009) 0.79 (0.031) max. cathode stripe note 3 0.50 (0.020) ref. 0.46 0.56 (0.018) (0.022) 0.25 (0.010) max.* note 2 0.20 (0.008) max. note 3 anode 1.65 1.91 (0.065) (0.075) dia. cathode 11.68 10.67 (0.460) (0.420) both sides 0.94 1.24 (0.037) (0.049) 2.92 (0.115) max. 0.76 0.89 (0.030) (0.035) r. 2.08 2.34 (0.082) (0.092) 0.63 0.38 (0.025) (0.015) 2.03 (0.080) 1.78 (0.070) 0.79 (0.031) 0.53 (0.021) 0.18 0.23 (0.007) (0.009) 2.21 1.96 (0.087) (0.077) cathode stripe note 3 notes: 1. all dimensions are in millimetres (inches). 2. protruding support tab is connected to anode lead. 3. lead polarity for these ts algaas subminiature lamps is opposite to the lead polarity of subminiature lamps using other led technologies.
4 optical characteristics at t a = 25 c part luminous color, viewing number intensity total flux peak dominant angle luminous (low i v (mcd) f v (mlm) wavelength wavelength 2 q 1 / 2 efficacy current) @ 0.5 ma [1] @ 0.5 ma [2] l peak (nm) l d [3] (nm) degrees [4] h v [5] hlmp- min. typ. typ. typ. typ. typ. (lm/w) q156-h00xx 2.5 7 10.5 654 644 15 85 q152-g00xx 1.6 2 - 654 644 35 85 p156-eg0xx 0.63 2 10.5 654 644 75 85 notes: 1. the luminous intensity, iv, is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. f v is the total luminous flux output as measured with an integrating sphere. 3. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 4. q 1 / 2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity. 5. radiant intensity, i v , in watts/steradian, may be calculated from the equation i v = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt. optical characteristics at t a = 25 c luminous color, viewing intensity total flux peak dominant angle luminous part i v (mcd) f v (mlm) wavelength wavelength 2 q 1 / 2 efficacy number @ 20 ma [1] @ 20 ma [2] l peak (nm) l d [3] (nm) degrees [4] h v [5] hlmp- min. typ. typ. typ. typ. typ. (lm/w) q106-r00xx 100 400 280 654 644 15 85 q102-n00xx 25 100 - 654 644 35 85 p106-q00xx 63 130 280 654 644 75 85 absolute maximum ratings at t a = 25 c peak forward current [2] .......................................................... 300 ma average forward current (@ i peak = 300 ma) [1,2] .................... 30 ma dc forward current [3] ............................................................... 50 ma power dissipation .................................................................... 100 mw reverse voltage (i r = 100 m a) ......................................................... 5 v transient forward current (10 m s pulse) [4] ............................ 500 ma operating temperature range ...................................... -55 to +100 c storage temperature range .......................................... -55 to +100 c led junction temperature ....................................................... 110 c lead soldering temperature [1.6 mm (0.063 in.) from body ............................ 260 c for 5 seconds reflow soldering temperatures convective ir ..................... 235 c peak, above 183 c for 90 seconds vapor phase ........................................................ 215 c for 3 minutes notes: 1. maximum i avg at f = 1 khz, df = 10%. 2. refer to figure 7 to establish pulsed operating conditions. 3. derate linearly as shown in figure 6. 4. the transient peak current is the maximum non-recurring peak current the device can withstand without damaging the led die and wire bonds. it is not recommended that the device be operated at peak currents above the absolute maximum peak forward current.
5 electrical characteristics at t a = 25 c part forward reverse capacitance speed of response number voltage breakdown c (pf) t s (ns) (low v f (volts) v r (volts) v f = 0, thermal time constant current) @ i f = 0.5 ma @ i r = 100 m a f = 1 mhz resistance e -t/ t hlmp- typ. max. min. typ. typ. r q j-pin ( c/w) typ. q156 1.6 1.9 5 20 20 170 45 q152 1.6 1.9 5 20 20 170 45 p156 1.6 1.9 5 20 20 170 45 electrical characteristics at t a = 25 c forward reverse capacitance speed of response voltage breakdown c (pf) t s (ns) part v f (volts) v r (volts) v f = 0, thermal time constant number @ i f = 20 ma @ i r = 100 m a f = 1 mhz resistance e -t/ t hlmp- typ. max. min. typ. typ. r q j-pin ( c/w) typ. q106 1.9 2.4 5 20 20 170 45 q102 1.9 2.4 5 20 20 170 45 p106 1.9 2.4 5 20 20 170 45 figure 5. relative efficiency vs. peak forward current. figure 7. maximum average current vs. peak forward current. figure 6. maximum forward dc current vs. ambient temperature. derating based on t j max = 110 c. h v ?relative efficiency (normalized at 20 ma) 5 300 0.0 i peak ?peak forward current ?ma 10 20 50 100 2 1 200 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 s s figure 2. relative intensity vs. wavelength. figure 4. relative luminous intensity vs. dc forward current. figure 3. forward current vs. forward voltage. relative intensity 600 1000 10 -3 wavelength ?nm 700 500 10 -2 10 -1 1.0 relative luminous intensity (normalized at 20 ma) 2 0.5 0.01 i f ?dc forward current ?ma 51020 50 2.4 2.0 1.0 0.2 0.1 0.05 1 0.5 i f ?forward current ?ma 1.0 3.5 300 20 1 v f ?forward voltage ?v 1.5 2.0 2.5 3.0 200 100 50 10 5 2 0.5 0 i avg = average forward current ?ma 50 0 i peak ?peak forward current ?ma 150 250 50 40 30 20 10 100 200 300 f > 1000 hz f > 300 hz f > 100 hz i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 50 40 30 20 10 20 60 100 r q ja = 400?c/w r q ja = 550?c/w
6 normalized intensity 1.0 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 100 90 0.1 0.3 0.4 80 70 60 50 40 20 10 0 30 10 20 30 40 50 60 70 80 90 100 0.9 figure 8. hlmp-q106/-q156. normalized intensity 1.0 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 100 90 0.1 0.3 0.4 80 70 60 50 40 20 10 0 30 10 20 30 40 50 60 70 80 90 100 0.9 figure 9. hlmp-q102/-q152 normalized intensity 1.0 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 100 90 0.1 0.3 0.4 80 70 60 50 40 20 10 0 30 10 20 30 40 50 60 70 80 90 100 0.9 figure 10. hlmp-p106/-p156.
7 intensity bin limits bin min. max. e 0.63 1.25 f 1.00 2.00 g 1.60 3.20 h 2.50 5.00 j 4.00 8.00 k 6.30 12.50 l 10.00 20.00 m 16.00 32.00 n 25.00 50.00 p 40.00 80.00 q 63.00 125.00 r 100.00 200.00 s 160.00 320.00 t 250.00 500.00 u 400.00 800.00 v 630.00 1250.00 w 1000.00 2000.00 x 1600.00 3200.00 y 2500.00 5000.00 color bin limits package bin min. max. red 0 full distribution mechanical option 00 straight leads, bulk packaging, quantity of 500 parts 11 gull wing leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 12 gull wing lead, bulk packaging, quantity of 500 parts 14 gull wing leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel 21 yoke leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 22 yoke leads, bulk packaging, quantity of 500 parts 24 yoke leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel 31 z-bend leads, 12 mm tape on 7 in. dia. reel, 1500 parts per reel 32 z-bend leads, bulk packaging, quantity of 500 parts 34 z-bend leads, 12 mm tape on 13 in. dia. reel, 6000 parts per reel note: all categories are established for classification of products. products may not be available in all categories. please contact your local agilent representative for further clarification/information.
www.semiconductor.agilent.com data subject to change. copyright ? 2001 agilent technologies, inc. june 4, 2001 obsoletes 5968-5431e (2/99) 5980-2437e
product information and literature search | site map | login | register | contact us | home quick search about agilent | products & services | industries | international | online stores home > products & services > semiconductor products home > led design center > product information and literature product information and literature events guided selection library news releases order information global account sites partner portal product index hot links product center application notes datasheets faqs product notifications hlmp-p106-q001s subminiature high performance ts algaas red led lamps life cycle status ac - active this product is market released and in full production features l subminiature flat top package ideal for backlighting and light piping applications l wide range of drive currents 500 microamps to 50 ma l ideal for space limited applications l axial leads l 2.54 mm (0.100 inch) centre lead spacing l short leads; 3.7 mm (0.145 in.) description flat top package the hlmp-p106 series flat top lamps use an untinted, non- diffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. the flat top lamps are also ideal for use as emitters in light pipe applications. lead configurations all of these devices are made by encapsulating led chips on axial lead frames to form molded epoxy subminiature lamp packages. for more information refer to standard smt and through hole lead bend options for subminiature led lamps data sheet. technology these subminiature solid state lamps utilize a highly optimized led material technology, transparent substrate aluminum gallium arsenide (ts algaas). this led technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 micro-amps to 50 ma). the color is deep red at a dominant wavelength of 644 nm deep red. ts algaas is a flip-chip led technology, die attached to the anode lead and wire bonded to the cathode lead. click here to add this product to your 'my designcenter' links list. you must be logged in to use this feature. add to my links click here to receive updates about this product. you must be logged in to use this feature. keep me updated click here to receive help downloading files help downloading files file:///i|/imaging/bitting/cpl_images/datasheet83.html (1 of 2) [jun/29/2002 4:08:22 pm]
product information and literature application notes application brief: ab a05 - led thermal testing 60 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab a04: led lamp thermal properties 52 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab a02 - benefits of leds for instrument cluster lighting 42 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab i-011 - full color lcd backlighting with leds 32 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab d-007 - solutions for common led design errors in segmented display and multi- indicator applications 39 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab i-012 - temperature compensation circuit for constant led intensity 35 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1027: soldering led components 470 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1005 - operational considerations for led lamps and display devices 62 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1100 - selecting led lamps for automotive interior applications 163 kb pdf click here to email this file as an attachment. click here to add this file to your links data sheets & technical specifications datasheet: hlmp-p1x6/q1x2/q1x6 - subminiature high performance ts algaas led lamps 259 kb pdf click here to email this file as an attachment. click here to add this file to your links options datasheet: option 11,12,21,22,31,32,1l,1s,2l,2s - standard smt and through hole lead bend options for subminiature led lamps 221 kb pdf click here to email this file as an attachment. click here to add this file to your links reliability materials reliability data: hlmp-pxxx/qxxx/6xxx/70xx - subminiature lamps reliability data 47 kb pdf click here to email this file as an attachment. click here to add this file to your links ? 2000 - 2002 agilent technologies terms of use privacy statement file:///i|/imaging/bitting/cpl_images/datasheet83.html (2 of 2) [jun/29/2002 4:08:22 pm]
product information and literature search | site map | login | register | contact us | home quick search about agilent | products & services | industries | international | online stores home > products & services > semiconductor products home > led design center > product information and literature product information and literature events guided selection library news releases order information global account sites partner portal product index hot links product center application notes datasheets faqs product notifications hlmp-q106-r001s subminiature high performance ts algaas red led lamps life cycle status ac - active this product is market released and in full production features l subminiature dome package non-diffused dome for high brightness l wide range of drive currents 500 microamps to 50 ma l ideal for space limited applications l axial leads l 2.54 mm (0.100 inch) centre lead spacing l short leads; 3.7 mm (0.145 in.) description dome packages the hlmp-q106 series dome lamps, for use as indicators, use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern. lead configurations all of these devices are made by encapsulating led chips on axial lead frames to form molded epoxy subminiature lamp packages. for more information refer to standard smt and through hole lead bend options for subminiature led lamps data sheet. technology these subminiature solid state lamps utilize a highly optimized led material technology, transparent substrate aluminum gallium arsenide (ts algaas). this led technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 ma to 50 ma). the color is deep red at a dominant wavelength of 644 nm deep red. ts algaas is a flip-chip led technology, die attached to the anode lead and wire bonded to the cathode lead. click here to add this product to your 'my designcenter' links list. you must be logged in to use this feature. add to my links click here to receive updates about this product. you must be logged in to use this feature. keep me updated click here to receive help downloading files help downloading files file:///i|/imaging/bitting/cpl_images/datasheet84.html (1 of 2) [jun/29/2002 4:08:30 pm]
product information and literature application notes application brief: ab a05 - led thermal testing 60 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab a04: led lamp thermal properties 52 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab a02 - benefits of leds for instrument cluster lighting 42 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab i-011 - full color lcd backlighting with leds 32 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab d-007 - solutions for common led design errors in segmented display and multi- indicator applications 39 kb pdf click here to email this file as an attachment. click here to add this file to your links application brief: ab i-012 - temperature compensation circuit for constant led intensity 35 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1027: soldering led components 470 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1005 - operational considerations for led lamps and display devices 62 kb pdf click here to email this file as an attachment. click here to add this file to your links application note: an 1100 - selecting led lamps for automotive interior applications 163 kb pdf click here to email this file as an attachment. click here to add this file to your links data sheets & technical specifications datasheet: hlmp-p1x6/q1x2/q1x6 - subminiature high performance ts algaas led lamps 259 kb pdf click here to email this file as an attachment. click here to add this file to your links options datasheet: option 11,12,21,22,31,32,1l,1s,2l,2s - standard smt and through hole lead bend options for subminiature led lamps 221 kb pdf click here to email this file as an attachment. click here to add this file to your links reliability materials reliability data: hlmp-pxxx/qxxx/6xxx/70xx - subminiature lamps reliability data 47 kb pdf click here to email this file as an attachment. click here to add this file to your links ? 2000 - 2002 agilent technologies terms of use privacy statement file:///i|/imaging/bitting/cpl_images/datasheet84.html (2 of 2) [jun/29/2002 4:08:30 pm]

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